product description: ? halogen free, lead free, rohs compliant ? high i 2 t 1206 footprint surface mount fuse ? high inrush withstand capability ? excellent temperature and cycling characteristics ? rohs compliant, and lead free and halogen free construction ? compatible with solder reflow and wave solder applications ? flat panel displays and televisions ? automotive infotainment and ecu ? computer servers ? portable electronics ? mobile device chargers agency information ? curus recognition file number: e19180, guide jdyx2/jdyx8 ? aec-q200 automotive grade certified ordering ? 3000 fuses on 8mm tape-and-reel on a 7 inch (178mm) reel per eia standard 481. specify catalog symbol and package code suffix -tr(e.g., cc12h1a-tr) bussmann cc12h series high i 2 t chip? fuses technical data 4309 effective july 2014 supersedes may, 2013 bussmann is now part of eaton same great products plus even more. the bussmann brand of circuit protection products (formerly of the bussmann division of cooper industries) is now part of eatons electrical group, electronics division. halogen hf free pb
2 technical data 4309 effective july 2014 cc12h series high i 2 t chip? fuses electrical characteristics amp rating % of amp rating opening time 750ma-20a 100% 4 hours, min 1-3a 200% 1-60 seconds 1-5a 250% 5 seconds, max 1-5a 300% 0.1-3 seconds 750ma, 6-20a 350% 5 seconds, max 750ma-20a 1000% 0.2-20ms specifcations catalog symbol current rating (amps) voltage rating (vdc) interrupting rating* (amps) resistance ( )** typical typical melt (i 2 t)? dc typical voltage drop (mv)? alpha marking cc12h750ma 0.75 63 50 0.780 0.15 840 e cc12h1a 1 63 50 0.470 0.18 490 h cc12h1.5a 1.5 63 50 0.218 0.4 355 k cc12h2a 2 63 50 0.133 1.1 305 n cc12h2.5a 2.5 63 50 0.079 1.7 240 o cc12h3a 3 63 50 0.049 2.2 185 p cc12h3.5a 3.5 63 50 0.037 2.7 180 r cc12h4a 4 63 50 0.033 3.2 169 s cc12h4.5a 4.5 32 100 0.028 4.2 160 x cc12h5a 5 32 100 0.023 6.0 140 t cc12h6a 6 32 100 0.0155 8.0 140 f cc12h7a 7 32 100 0.011 9.0 120 j cc12h8a 8 32 100 0.007 12.0 80 m cc12h10a 10 32 100 0.0065 33 90 u cc12h12a 12 32 100 0.0045 45 80 w cc12h15a 15 32 100 0.0030 40 70 y cc12h20a 20 32 100 0.0020 50 60 q * dc interrupting rating (measured at rated voltage, time constant of less than 50 microseconds, battery source) ** dc cold resistance (measured at 10% of rated current) ? typical melting i 2 t (measured with a battery bank at rated dc voltage, 10x-rated current, not to exceed interrupting rating, time constant of calibrated circuit less than 50 microseconds) ? typical voltage drop (measured at rated current after temperature stabilizes) device designed to carry rated current for four hours minimum. an operating current of 80% or less of rated current is recommended, with further derating required at elevated ambient temperatures. dimensions - mm (in) drawing not to scale. environmental data ? thermal shock: mil-std-202, method 107, test condition b ? vibration: mil-std-202, method 204, test condition c ? moisture resistance: mil-std-202, method 106, 50 day cycle ? solderability: ansi/j-std-002, test b ? normal ambient temperature: 23c ? operating temperature range -40c to +125c soldering method wave solder immersion: 260c, 10 seconds maximum. ? solder reflow: 260c, 30 seconds maximum. end view t op view side view 0.51 +/- 0.25 typ. (0.02 +/- 0.01) 0.51 +/- 0.25 typ. (0.02 +/- 0.01) 1.6 +/- 0.2 (0.063 +/- 0.008) 3.2 +/- 0.2 (0.126 + /- 0.008) 1.6 +/- 0.2 typ. (0.063 +/- 0.008) 0.6 + 0.2, -0.15 (0.024 +0.008, -0.006) pad layout 1.52 (0.06) 1.52 (0.06) 2.03 (0.08) www.eaton.com/elx
3 time-current curves 750ma-5a average melt technical data 4309 effective july 2014 cc12h series high i 2 t chip? fuses www.eaton.com/elx
4 technical data 4309 effective july 2014 cc12h series high i 2 t chip? fuses time-current curves 6a-20a average melt www.eaton.com/elx
5 technical data 4309 effective july 2014 cc12h series high i 2 t chip? fuses i 2 t vs. time curves 750ma-5a i 2 t (a 2 s) www.eaton.com/elx
6 i 2 t vs. time curves 6a-20a technical data 4309 effective july 2014 cc12h series high i 2 t chip? fuses i 2 t (a 2 s) www.eaton.com/elx
7 technical data 4309 effective july 2014 cc12h series high i 2 t chip? fuses i 2 t vs. current curves 750ma-5a i 2 t (a 2 s) www.eaton.com/elx
8 technical data 4309 effective july 2014 cc12h series high i 2 t chip? fuses i 2 t vs. current curves 6a-20a i 2 t (a 2 s) www.eaton.com/elx
9 eaton is a registered trademark. all other trademarks are property of their respective owners. eatons electrical group electronics division 114 old state road ellisville, mo 63021 united states www.eaton.com/elx ? 2014 eaton all rights reserved publication no. 4309 bu-sb14479 july 2014 north america eatons electrical group electronics division 1225 broken sound parkway nw suite f boca raton, fl 33487-3533 tel: 1-561-998-4100 fax: 1-561-241-6640 toll free: 1-888-414-2645 eatons electrical group electronics division p.o. box 14460 st. louis, mo 63178-4460 tel: 1-636-394-2877 fax: 1-636-527-1607 europe eatons electrical group electronics division burton-on-the-wolds leicestershire, le 12 5th uk phone: +44 (0) 1509 882 600 fax: +44 (0) 1509 882 786 eatons electrical group electronics division avda santa eulalia, 290 terrassa, barcelona 08223 spain phone: +34-93-736-2813 fax: +34-93-783-5055 asia pacifc eatons electrical group electronics division no.2, #06-01 serangoon north avenue 5 singapore 554911 tel: +65 6645 9888 fax: +65 6728 3155 the only controlled copy of this data sheet is the electronic read-only version located on the bussmann network drive. all other copies of this document are by defnition uncontrolled. this bulle tin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. bussmann reserves the right, without notice, to ch ange design or construction of any products and to discontinue or limit distribution of any products. bussmann also reserves the right to change or update, without notice, any technical information cont ained in this bulletin. once a product has been selected, it should be tested by the user in all possible applications. life support policy: bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an offcer of the company . life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signifcant injury to the user. technical data 4309 effective july 2014 cc12h series high i 2 t chip? fuses te mp er at ur e t t p t s t c -5c ti me 25c to p eak ti me 25c t sm in t sm ax t l t p pr ehea t a ma x. ra mp up ra te = 3 c/ s ma x. ra mp do wn ra te = 6 c/ s t a b l e 1 - s t a n d a r d s n p b s o l d e r ( t c ) v olume v olume packagem m 3 mm 3 thickness <350 > _ 350 <2.5mm 235c 220c > _ 2.5mm 220c 220c t a b l e 2 - l e a d ( p b ) f r e e s o l d e r ( t c ) v olume v olume v olume packagem m 3 mm 3 mm 3 thickness <350 350 - 2000 >2000 <1.6mm 260c 260c 260c 1.6 ? 2.5mm 260c 250c 245c >2.5mm 250c 245c 245c reference jdec j-std-020d profile feature standard snpb solder lead (pb) free solder preheat and soak ? t emperature min.( t smin ) 100c 150c ? t emperature max. (t smax ) 150c 200c ? ti me (t smin to t smax ) (t s ) 60-120 seconds 60-120 seconds a verage ramp up rate t smax to t p 3c/ second max. 3c/ second max. liquidous temperature (t l ) 183c 217c t ime at liquidous (t l ) 60-150 seconds 60-150 seconds peak package body temperature (t p )* ta ble 1t able 2 ti me (t p )** within 5 c of the specified classification temperature (t c ) 20 seconds** 30 seconds** a verage ramp-down rate (t p to t smax ) 6c/ second max. 6c/ second max. t ime 25c to peak t emperature 6 minutes max. 8 minutes max. * to lerance for peak profile temperature (t p ) is defined as a supplier minimum and a user maximum . ** to lerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum . solder reflow profile www.eaton.com/elx
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